In recent years, Intel has experienced difficulties in developing semiconductor manufacturing. The scythe found on the stone at the stage of mastering the norms of 10 nm. The manufacturer was unable to fulfill its plans, began to shift deadlines and lag behind competitors. The technical process, developed quite a long time ago, has not been able to be brought to a level for several years, at which an acceptable percentage of the output of suitable products for mass production is provided. Intel has only recently begun mass-supplying 10nm products. Meanwhile, TSMC has managed to master the 10 nm, 7 nm and 5 nm standards. By releasing 5nm products, the contract manufacturer is already mastering the next step in technological standards.
Expecting to master 7nm standards in 2023, when TSMC is already moving to 3nm or less, Intel is looking for ways to remain competitive. According to the source, the company has come up with a simple, ingenious way – most likely, Intel will resort to renaming the nodes so that the new names “comply with industry agreements.” There is no information about new names yet. It remains to add that all this is unofficial information, so it should be taken critically.